Double automatic picosecond laser sapphire cutting machine
Ultra thin glass laser cutting machine, picosecond laser cutting equipment, sapphire laser cutting machine Double automatic picosecond laser sapphire cutting machine Sapphire substrate picosecond laser cutting machine More detailed information pls contact us by Tel/Whatsapp:+86 13751144594 Skype:zhouliusheng QQ:271410213 Email:zhouliusheng@126.com Sapphire crystal picosecond laser cutting machine hotline: 13751144594 contact person: Mr. Zhou This equipment is an ultra precision laser cutting machine developed for sapphire cutting in 3C manufacturing industry. It is mainly used for cutting and cutting Sapphire Mobile phone sapphire HOME key, camera protection lens, fingerprint identification, glass cutting and other brittle materials cutting hole . The introduction of high speed non taper sapphire glass picosecond laser cutting machine, its main features: first, vertical cutting, no taper; Two is the technical efficiency is high; three is cutting quality will be better This equipment is an ultra precision laser cutting machine developed for sapphire cutting in 3C manufacturing industry. It is mainly used for hand Machine sapphire HOME key, camera lens protection, cutting and so on. It is equipped with an ultra fast laser with high machining accuracy and heat The utility model has the advantages of small area, no burrs and residues on the edges of processing, and long-term stability. Fine drilling of various materials is also possible Cutting, slotting and other micro machining. It is equipped with double vibration lens, double station turntable and automatic feeding and unloading device It has high automation and high processing efficiency. The dual cutting head can process two 2 inch sapphire at the same time, so the efficiency is better than that of the single head Twice as high as the two station structure is adopted, laser processing and automatic feeding and unloading are performed without mutual interference at the same time. High machining accuracy, small heat affected areas, no burrs and residues on the edges of the machined edges Automatic feeding and unloading, double station processing, high efficiency and stable performance It can be used for precise drilling, cutting and slotting of various materials • non-contact processing, without changing consumables, low cost Main application areas: LED sapphire substrate cutting, LED sapphire filament bracket cutting, cell phone sapphire HOME key cutting Camera protection, lens cutting, sapphire glass, mobile phone screen cutting, mobile phones, watches and wearable devices sapphire cover plate Cutting, etc.. Sapphire window cutting, fingerprint identification, glass cutting, and other brittle materials cutting holes. Hot wire Remarks: 13751144594 contact person: Mr. Zhou
Ultra thin glass laser cutting machine, picosecond laser cutting equipment, sapphire laser cutting machine Double automatic picosecond laser sapphire cutting machine Sapphire substrate picosecond laser cutting machine More detailed information pls contact us by Tel/Whatsapp:+86 13751144594 Skype:zhouliusheng QQ:271410213 Email:zhouliusheng@126.com Sapphire crystal picosecond laser cutting machine hotline: 13751144594 contact person: Mr. Zhou This equipment is an ultra precision laser cutting machine developed for sapphire cutting in 3C manufacturing industry. It is mainly used for cutting and cutting Sapphire Mobile phone sapphire HOME key, camera protection lens, fingerprint identification, glass cutting and other brittle materials cutting hole . The introduction of high speed non taper sapphire glass picosecond laser cutting machine, its main features: first, vertical cutting, no taper; Two is the technical efficiency is high; three is cutting quality will be better This equipment is an ultra precision laser cutting machine developed for sapphire cutting in 3C manufacturing industry. It is mainly used for hand Machine sapphire HOME key, camera lens protection, cutting and so on. It is equipped with an ultra fast laser with high machining accuracy and heat The utility model has the advantages of small area, no burrs and residues on the edges of processing, and long-term stability. Fine drilling of various materials is also possible Cutting, slotting and other micro machining. It is equipped with double vibration lens, double station turntable and automatic feeding and unloading device It has high automation and high processing efficiency. The dual cutting head can process two 2 inch sapphire at the same time, so the efficiency is better than that of the single head Twice as high as the two station structure is adopted, laser processing and automatic feeding and unloading are performed without mutual interference at the same time. High machining accuracy, small heat affected areas, no burrs and residues on the edges of the machined edges Automatic feeding and unloading, double station processing, high efficiency and stable performance It can be used for precise drilling, cutting and slotting of various materials • non-contact processing, without changing consumables, low cost Main application areas: LED sapphire substrate cutting, LED sapphire filament bracket cutting, cell phone sapphire HOME key cutting Camera protection, lens cutting, sapphire glass, mobile phone screen cutting, mobile phones, watches and wearable devices sapphire cover plate Cutting, etc.. Sapphire window cutting, fingerprint identification, glass cutting, and other brittle materials cutting holes. Hot wire Remarks: 13751144594 contact person: Mr. Zhou